Product Description
The Z19 development board equipped with AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series XCZU19EG device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC HPC, QSFP28+, DP, M.2, CAN/RS485.
Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (PCIe, QSFP28+), high-speed storage (M.2) and video applications (DP).
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
- ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz
◆ ARM® dual-core Cortex™-R5F up to 533 MHz
◆ Mali-400 MP2 GPU
◆ 16nm FinFET+ FPGA fabric
● 8 GByte (64-bit) DDR4 SDRAM on PS
● 1 x DDR4 SODIMM Card slot on PL
● 2 x 64 MB QSPI Flash
● 32 GB eMMC Flash
● 1 x M.2 Interface on PS
● 1 x DP Interface on PS
● 4 x QSFP28+ (per line 100Gbps)
● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
● 2 x FMC HPC connectors (FMC1 has 36 pairs lvds io and 8 pairs GTH, FMC2 has 60 pairs lvds io and 8 pairs GTH) - ● 1 x 2 lane MIPI on PL
● 1 x PCIe Gen 3 x 8 slot
● 2 x CAN Interfaces on PS
● 2 x RS485 Interfaces on PL
● 2 x USB3.0 on PS + 2 x USB2.0 on PS
● 3 x UART (2 x USB to USRT + FPC UART)
● 1 x JTAG
● 1 x Micro SD
● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor(LM75)
● 4 x SATA Interface
● 4 x SMA
● 1 x RTC (Real-time clock)
● 4 x LED (1 x PWR + 1 x DONE + 1 x PS + 1 x PL), 3 x KEY (1 x RST + 1 x PS + 1 x PL)
● 12V single supply
● Dimensions: 250 x 170 mm form factor
- Specifications
- What's Inside
Board Features
Featuring the AMD/Xilinx Zynq™ UltraScale+™ MPSoC XCZU19EG-2FFVC1760I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU19EG development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC devices – it is low-profile and covers the whole XCZU19EG device surface.
| Development Board | 1 | Heatsink Kit (preinstalled) | 1 |
|---|---|---|---|
| Mini USB Cable | 1 | USB Downloader Cable / set | 1 |
| 12V Power Adapter | 1 | Acrylic Plate | 1 |
| TF Card | 1 | Card Reader | 1 |
Product Matrix
| Product Model | Preferred Model | MPSoC | DDR4 SDRAM (PS) | DDR4 SDRAM (PL) | QSPI Flash | eMMC Flash | USD Price | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Z19-P | √ | XCZU19EG-2FFVC1760I | 5 GB | 4 GB | 2 x 64 MB | 32GB | 8986 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
- Download
Z19 User Manual
2024-02-29
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