Product Description
The FAN6050 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
- Specifications
- What's Inside
Product parameters
- ● 12V single supply
● Dimensions: 59 x 49 mm form factor
What's Inside the Box
| FAN6050 | 1 |
|---|
Product Matrix
| Product Model | USD Price |
|---|---|
| FAN6050 | 15 |
No documentation downloads are currently listed for this product on the manufacturer's website. Please contact our support for the user manual, schematics, and reference designs.
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