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HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P

HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
HEA13 FPGA Dev Board & Kit with AMD Virtex US+ XCVU13P
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  • Stock: In Stock
  • Model: HEA13
  • SKU: HEA13
ALINX
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$14,976.00
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Product Description

The HEA13 FPGA development board integrates a AMD (Xilinx) Virtex Ultrascale+ XCV13P FPGA with an NVIDIA Jetson AGX Orin/Thor module, interconnected via PCIe Gen3 x8. The ACVU13 core board features 20GB of DDR4 and four QSFP28 (100G) interfaces. The AGX Orin module delivers up to 275 TOPS of AI performance, while the Thor module provides an impressive 2070 TFLOPs. This platform is ideal for applications in robotics, autonomous driving, edge AI, and data center acceleration.

Applications

  • ● Compute Acceleration

    ● Machine Learning and AI

  • ● Network Acceleration

    ● Wired Communications

  • ● 5G Baseband

    ● Radar

  • ● Test and Measurement

    ● Emulation and Prototyping



Key Features

  • AMD Virtex Ultrascale+™ VU13P System● AMD Virtex Ultrascale+™ XCVU13P:
    ◆ 16nm FinFET FPGA fabric
    ◆ Integrated 100G Ethernet MAC and 150G Interlaken cores
    ◆ 76 x GTY transceivers, up to 28.21 Gbps
    ◆ More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
    ●  2 x 10GB (80bit) DDR4 SDRAM
    ● 256MB QSPI Flash
    ●  1 x NVIDIA Jetson AGX Orin / Thor Series Modules Interface
    ● 4 x 100Gbps QSFP28 connectors
    ● 2 x FMC+◆ FMC1+ has 122 FPGA IOs and 16 Lane GTY
    ◆ FMC2+ has 168 FPGA IOs and 16 lane GTY
     ● 1 x Gigabit Ethernet on PL
    ● 1 x UART
    ● 1 x Micro SD
    ● 2 x SMA (2 x in )
    ● 3 x LED
    ● 3 x KEY
    ● 12V single supply
    ● Dimensions: 271 x 200 mm form factor
  • NVIDIA Jetson Orin / Thor Series System● NVIDIA Jetson Thor Series Modules:
    ◆ Jetson Thor Series Modules 128 GB 256bit LPDDR5X memory: Up to 2070 TFLOPs.
    (*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)    ● NVIDIA Jetson AGX Orin Module:
    ◆ Jetson AGX Orin Modules 64GB: Up to 275 TOPs.
    ◆ Jetson AGX Orin Modules 32GB: Up to 241 TOPs.
    (*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)    ● 1 x DP Interface for NVIDIA JETSON AGX Orin Modules
    ● 1 x Gigabit Ethernet (10G) for NVIDIA JETSON AGX Orin Modules
    ● 1 x Gigabit Ethernet (5G) for NVIDIA JETSON Thor Series Modules
    ● 1 x M.2 SSD interface for NVIDIA JETSON AGX Orin Modules
    ● 1 x M.2 WIFI/BT interface for NVIDIA JETSON AGX Orin Modules
    ● 2 x USB3.2 Type-C for NVIDIA JETSON AGX Orin Modules
    ● 1 x EEPROM: 24AA04 I/SN, 4-Kbit connected to NVIDIA JETSON AGX Orin Modules
    ● 1 x Micro SD 2.0 for NVIDIA JETSON AGX Orin Modules
    ● 40-pin connector for NVIDIA JETSON AGX Orin Modules

Product Information

  • Specifications
  • What's Inside
Board Features

Featuring the AMD/Xilinx Virtex Ultrascale+™ XCVU13P-2FHGB2104I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+™ based application.


* The HEA13 development board consists of a ACVU13 SoM and base board. If you want to purchase ACVU13 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Virtex Ultrascale+™ XCVU13P FPGA development board and Some accessories

The Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.

System-on-Module1Base Board1
Mini USB Cable1USB Downloader Cable / set1
12V Power Adapter1Heatsink Kit (preinstalled)1
SD Card1

Product Selection Matrix

Product Matrix

Product ModelPreferred ModelFPGA DevicesDDR4 SDRAMQSPI FlashGTY 28.21GbpsUSD Price
HEA13√XCVU13P-2FHGB2104I20GB2 x 128MB7614,976
HEA13 + NVIDIA Jetson AGX Orin 32GB GPU Modules√XCVU13P-2FHGB2104I20GB2 x 128MB7617,971
HEA13 + NVIDIA Jetson AGX Orin 64GB GPU Modules√XCVU13P-2FHGB2104I20GB2 x 128MB7619,469
HEA13 + NVIDIA Jetson Thor T5000 Modules√XCVU13P-2FHGB2104I20GB2 x 128MB7622,464


1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.


We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.

Documentations

  • HEA13 V1.0 User Manual

    2026-05-08
    Download

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