The AXU2CGB-I development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, DP, M.2, USB 3.0, CAN, RS485, MIPI, UART.
Provide high-speed storage (M.2) and video applications (DP).
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC: ◆ ARM® dual-core Cortex™-A53 up to 1.2 GHz ◆ ARM® dual-core Cortex™-R5F up to 533 MHz ◆ 16nm FinFET+ FPGA fabric ● Pluggable module with 4 x Panasonic board-to-board connectors ● 4GByte DDR4 SDRAM on PS ● 1GByte DDR4 SDRAM on PL ● 32MB QSPI Flash ● 32GB eMMC Flash
Base Board
● 1 x M.2 Card slot on PS ● 1 x DP Interface on PS ● 1 x 2 lane MIPI on PL ● 2 x CAN on ps ● 2 x RS485 on PL ● 2 x USB3.0 on PS + 2 x USB2.0 on PS ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75) ● 2 x Gigabit Ethernet (1 x PS + 1 x PL) ● 2 x UART (1 x PS + 1 x PL) (USB to UART) ● 1 x Micro SD ● 1 x RTC (Real-time clock) ● 2 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.) ● LED (1 x pwr + 1 x PL + 1 x PS) + KEY (1 x RST + 1 x PS + 1 x PL) ● 12V single supply ● Dimensions: 160 x 100 mm form factor
Product Information
Specifications
What's Inside
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ MPSoC XCZU2CG-1SFVC784I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box. The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.
* The AXU2CGB-E development board consists of a ACU2CG-I SoM and base board. If you want to purchase ACU2CG-I SoM separately. Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU2CG development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
System-on-Module
1
Base Board
1
Heatsink Kit (preinstalled)
1
USB Downloader Cable / set
1 Set
12V Power Adapter
1
Acrylic board
1
Mini USB Cable
1
Card Reader
1
TF Card
1
Product Selection Matrix
Product Matrix
Product Model
Preferred Model
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 SDRAM (PL)
QSPI Flash
eMMC Flash
GTR
USD Price
AXU2CGB-E
√
XCZU2CG-1SFVC784E
2 GB
N/A
32 MB
8 GB
4
539
AXU2CGB-I
√
XCZU2CG-1SFVC784I
4 GB
1 GB
32 MB
32 GB
4
749
AXU3EGB
√
XCZU3EG-1SFVC784I
4 GB
1 GB
32 MB
32 GB
4
809
AXU4EVB-E
√
XCZU4EV-1SFVC784I
4 GB
1 GB
32 MB
32 GB
4
1003
AXU5EVB-E
√
XCZU5EV-2SFVC784I
4 GB
1 GB
32 MB
32 GB
4
1198
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock. 2. We offer custom configuration, a MOQ applies. Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials. Please contact us should you have any need.
