Menu
Your Cart

AX7350B Dev Board & Kit with AMD Zynq™ 7000 SoC XC7Z035

AX7350B Dev Board & Kit with AMD Zynq™ 7000 SoC XC7Z035
AX7350B Dev Board & Kit with AMD Zynq™ 7000 SoC XC7Z035
This product qualifies for free shipping
This block is set to appear automatically on products above a certain price, which may qualify for free shipping or other perks.
  • Stock: In Stock
  • Model: AX7350B V2.0
  • SKU: AX7350B V2.0
190 samples sold
$824.00
Product Description

The AX7350B SoC development board equipped with the AMD/Xilinx Zynq™ 7000 SoC-series XC7Z035 device, delivers standout performance with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet.


Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (SFP+).

Applications

  • Automotive

    ● Road Sign Recognition

    ● ADAS

    ● Smart Transportation

  • Communication Network

    ● Ethernet Backhaul

    ● Small Cell Baseband

    ● Network Switch

    ● Flexible radio platform

  • Industrial

    ● Motor control

    ● Industrial Control

    ● Industrial IoT

    ● Instrumentation

    ● Smart Grid

  • Video and Image Processing

    ● Professional Cameras

    ● Computer Vision

    ● Machine Vision

  • Medical

    ● Endoscop

    ● Ultrasound, CT, MRI



Key Features

  • ● AMD/Xilinx Zynq™ 7000 SoC:
    ◆ ARM® dual-core Cortex™-A9 up to 800 MHz
    ◆ Xilinx Kintex 7 28nm FPGA fabric
    ● 1 GByte (32-bit) DDR3 SDRAM on PS
    ● 1 GByte (32-bit) DDR3 SDRAM on PL
    ● 32 MB QSPI Flash
    ● 8 GB eMMC Flash
    ● 1 x FMC LPC (FMC has 34 pairs lvds io and 1 pairs GTX)
    ● 1 x HDMI out
    ● 2 x SFP+ (per line 10Gbps)
    ● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
  • ● 4 x USB2.0 (Host)
    ● 1 x USB to UART on PS
    ● 1 x PCIe® Gen2 ×4 (PL)
    ● 1 x JTAG
    ● 1 x Micro SD
    ● LED (1 x PWR + 1 x DONE + 1 x RxD + 1 x TxD + PS LED + 4 x PL LED)
    ● KEY (1 x PS RST + 1 x PS KEY + 4 x PS KEY)
    ● 12V single supply
    ● Dimensions: 220 x 125 mm form factor

Product Information

  • Specifications
  • What's Inside
Board Features

Featuring the AMD/Xilinx Zynq™ 7000 SoC XC7Z035-2FFG676I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ 7000 SoC based application.

What's Inside the Box

ALINX AMD Xilinx Zynq™ 7000 SoC XC7Z035 development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA and SoC devices – it is low-profile and covers the whole XC7Z035 device surface.

Development Board1Heatsink Kit (preinstalled)1
Mini USB Cable2Transparent protective board1
12V Power Adapter1Card Reader1
TF Card1 

Product Selection Matrix

Product Matrix

Product ModelPreferred ModelZynq 7000 SoCDDR3 SDRAM (PS)DDR3 SDRAM (PL)QSPI FlasheMMCUSD Price
AX7350BXC7Z035-2FFG676I1 GB1 GB32 MB8GB824


1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.


We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.

Documentations

  • AX7350B_User Manual_V2.0

    2026-07-17
    Download
  • AX7350B User Manual

    2023-04-25
    Download

Write a review

Note: HTML is not translated!
Bad Good